>> WCu Alloy

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  Tungsten Copper Plate

  Parameters Class Chemical Composition (wt%) Density Hardness Resistivity IACS Bending Strength Cu Total Impurities≤ W g/cm3  ≥ HB Kgf/mm2 ≥ μΩ.cm  ≤ %  ≥ MPa ≥ W50/Cu50 50±2.0 0.5 Balance 11.85 115 3.2 54 — W55/Cu45 45±2.0 0.5 Balance 12.3 125 3.5 49 — W60/Cu40 40±2.0 0.5 Balance 12.75 140 3.7 47 — W65/Cu35 35±2.0 0.5 Balance 13.3 155 3.9 44 — W70/Cu30 30±2.0 0.5 Balance 13.8 175 4.1 42 790 W75/Cu25 25±2.0 0.5 Balance 14.5 195 4.5 38 885 W80/Cu20 20±2.0 0.5 Balance 15.15 220 5 34 980 W85/Cu15 15±2.0 0.5 Balance 15.9 240 5.7 30 1080 W90/Cu10 10±2.0 0.5 Balance 16.75 260 6.5 27 1160  

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  c103

  Parameters Physical Property Description Chemical Composition Copper (Cu), Tungsten (W), Nickel (Ni) Density Approximately 15.2 g/cm³ Melting Point Approximately 1370°C (2498°F) Coefficient of Expansion 6.9 × 10^-6/°C Thermal Conductivity 150 W/(m·K) Electrical Conductivity Approximately 20 MS/m Young’s Modulus Approximately 240 GPa Tensile Strength Approximately 900 MPa Yield Strength Approximately 650 MPa Hardness Approximately 250 HB Magnetic Non-magnetic

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  Tungsten copper electrode

  Parameters  Physical Properties Tungsten-Copper Electrodes Density High density, approximately 18.0 g/cm³ Melting Point Approximately 3,400°C (6,152°F) Thermal Conductivity Excellent thermal conductivity Electrical Resistivity Relatively low Coefficient of Thermal Expansion Low coefficient of thermal expansion Flexural Strength High flexural strength Corrosion Resistance Good corrosion resistance Wear Resistance Good wear resistance Machinability High machinability Lifespan Relatively long

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  WCu Plate

  Parameters Class Chemical Composition (wt%) Density Hardness Resistivity IACS Bending Strength Cu Total Impurities≤ W g/cm3  ≥ HB Kgf/mm2 ≥ μΩ.cm  ≤ %  ≥ MPa ≥ W50/Cu50 50±2.0 0.5 Balance 11.85 115 3.2 54 — W55/Cu45 45±2.0 0.5 Balance 12.3 125 3.5 49 — W60/Cu40 40±2.0 0.5 Balance 12.75 140 3.7 47 — W65/Cu35 35±2.0 0.5 Balance 13.3 155 3.9 44 — W70/Cu30 30±2.0 0.5 Balance 13.8 175 4.1 42 790 W75/Cu25 25±2.0 0.5 Balance 14.5 195 4.5 38 885 W80/Cu20 20±2.0 0.5 Balance 15.15 220 5 34 980 W85/Cu15 15±2.0 0.5 Balance 15.9 240 5.7 30 1080 W90/Cu10 10±2.0 0.5 Balance 16.75 260 6.5 27 1160

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  Tungsten Copper Alloy Dics&Ring

  Parameters Class Chemical Composition (wt%) Density Hardness Resistivity IACS Bending Strength Cu Total Impurities≤ W g/cm3  ≥ HB Kgf/mm2 ≥ μΩ.cm  ≤ %  ≥ MPa ≥ W50/Cu50 50±2.0 0.5 Balance 11.85 115 3.2 54 — W55/Cu45 45±2.0 0.5 Balance 12.3 125 3.5 49 — W60/Cu40 40±2.0 0.5 Balance 12.75 140 3.7 47 — W65/Cu35 35±2.0 0.5 Balance 13.3 155 3.9 44 — W70/Cu30 30±2.0 0.5 Balance 13.8 175 4.1 42 790 W75/Cu25 25±2.0 0.5 Balance 14.5 195 4.5 38 885 W80/Cu20 20±2.0 0.5 Balance 15.15 220 5 34 980 W85/Cu15 15±2.0 0.5 Balance 15.9 240 5.7 30 1080 W90/Cu10 10±2.0 0.5 Balance 16.75 260 6.5 27 1160

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  Tungsten Copper Alloy Bar&Rod

  Parameters Class Chemical Composition (wt%) Density Hardness Resistivity IACS Bending Strength Cu Total Impurities≤ W g/cm3  ≥ HB Kgf/mm2 ≥ μΩ.cm  ≤ %  ≥ MPa ≥ W50/Cu50 50±2.0 0.5 Balance 11.85 115 3.2 54 — W55/Cu45 45±2.0 0.5 Balance 12.3 125 3.5 49 — W60/Cu40 40±2.0 0.5 Balance 12.75 140 3.7 47 — W65/Cu35 35±2.0 0.5 Balance 13.3 155 3.9 44 — W70/Cu30 30±2.0 0.5 Balance 13.8 175 4.1 42 790 W75/Cu25 25±2.0 0.5 Balance 14.5 195 4.5 38 885 W80/Cu20 20±2.0 0.5 Balance 15.15 220 5 34 980 W85/Cu15 15±2.0 0.5 Balance 15.9 240 5.7 30 1080 W90/Cu10 10±2.0 0.5 Balance 16.75 260 6.5 27 1160