Optical chip base is an important heat dissipation component in optical module components, mainly made of tungsten copper alloy material. Tungsten copper alloy is a pseudo alloy composed of tungsten elements and copper elements. The copper content is 10% to 50%. It has a small volume expansion coefficient, excellent electrical conductivity, thermal conductivity, high temperature resistance, corrosion resistance and resistance to corrosion. Characteristics such as oxidation properties have high application value in the high-speed optical module industry.
First of all, the low volume expansion coefficient of tungsten-copper alloy is particularly important when the optical module is working. As the working speed of the optical module increases, the heat generated inside will also increase sharply. If the expansion coefficient of the heat dissipation material is too large, it may cause the structure of the optical module to become unstable, thereby affecting its performance. The low expansion coefficient of tungsten-copper alloy ensures that it can maintain a stable structure in high-temperature environments, thereby ensuring the stable operation of the optical module.
Secondly, tungsten copper alloy has good electrical and thermal conductivity. In high-speed optical modules, the heat generated by the optical chip needs to be dissipated in time to avoid performance degradation or damage caused by excessive temperature. The high thermal conductivity of tungsten-copper alloy can quickly conduct heat to the heat sink or other heat dissipation structures, thereby effectively reducing the operating temperature of the optical chip. At the same time, its good conductivity also ensures the stable operation of the internal circuit of the optical module.
In addition, tungsten copper alloy also has properties such as high temperature resistance, wear resistance, corrosion resistance and oxidation resistance. These characteristics enable tungsten-copper alloy to maintain stable performance in harsh working environments, thereby extending the service life of the optical module.
It is understood that depending on the transmission power of computing power and data centers, the performance requirements for the heat dissipation base are also different. Tungsten copper alloys with different compositions can meet the needs of 400G, 800G, and 1.6T optical modules.
