2.Molybdenum plates can be applied to component manufacturing in the semiconductor industry.
3.Molybdenum plates can also be made into molds.
Thickness mm |
Width mm |
Length mm |
2.0 |
80 |
150 |
3.0 |
100 |
300 |
4.0-5.0 |
200 |
600 |
5.0-10.0 |
300 |
1200 |
> 60 |
< 1200 |
< 6000 |
Our company supplies various types of this plate according to the special needs of the dimensions or drawings.
Element |
Ni |
Mg |
Fe |
Pb |
Al |
Bi |
Si |
Cd |
Ca |
P |
Concentration(%) |
0.003 |
0.002 |
0.005 |
0.0001 |
0.002 |
0.0001 |
0.002 |
0.0001 |
0.002 |
0.001 |
Element |
C |
O |
N |
Sb |
Sn |
Mo |
|
|
|
|
Concentration(%) |
0.01 |
0.003 |
0.003 |
0.0005 |
0.0001 |
balance |
|
|
|
Good corrosion resistance
High wear resistance
High strength
Uniform internal organization
Good resistance to high temperature creep.
Atomic number | 42 |
CAS number | 7439-98-7 |
Atomic mass | 95.94 [g/mol] |
Melting point | 2620 °C |
Boiling point | 4639 °C |
Density at 20 °C | 10.22 [g/cm³] |
Crystal structure | Body-centered cubic |
Coefficient of linear thermal expansion at 20 °C | 5.2 × 10-6 [m/(mK)] |
Thermal conductivity at 20 °C | 142 [W/(mK)] |
Specific heat at 20 °C | 0.25 [J/(gK)] |
Electrical conductivity at 20 °C | 17.9 × 106 [S/m] |
Specific electrical resistance at 20 °C | 0.056 [(Ωmm2)/m] |
2.Molybdenum plates can be applied to component manufacturing in the semiconductor industry.
3.Molybdenum plates can also be made into molds.