1.Molybdenum plates can be applied to the electronics industry.
2.Molybdenum plates can be applied to component manufacturing in the semiconductor industry.
3.Molybdenum plates can also be made into molds.
|
Thickness mm |
Width mm |
Length mm |
|
2.0 |
1300 |
4000 |
|
3.0 |
1200 |
4000 |
|
4.0-5.0 |
1200 |
3500 |
|
5.0-10.0 |
1200 |
3500 |
|
> 10.0 |
1200 |
3500 |
Our company supplies various types of this plate according to the special needs of the dimensions or drawings.
|
Element |
Ni |
Mg |
Fe |
Pb |
Al |
Bi |
Si |
Cd |
Ca |
P |
|
Concentration(%) |
0.003 |
0.002 |
0.005 |
0.0001 |
0.002 |
0.0001 |
0.002 |
0.0001 |
0.002 |
0.001 |
|
Element |
C |
O |
N |
Sb |
Sn |
Mo |
||||
|
Concentration(%) |
0.01 |
0.003 |
0.003 |
0.0005 |
0.0001 |
balance |
||||
Good corrosion resistance
High wear resistance
High strength
Uniform internal organization
Good resistance to high temperature creep.
| Atomic number | 42 |
| CAS number | 7439-98-7 |
| Atomic mass | 95.94 [g/mol] |
| Melting point | 2620 °C |
| Boiling point | 4639 °C |
| Density at 20 °C | 10.22 [g/cm³] |
| Crystal structure | Body-centered cubic |
| Coefficient of linear thermal expansion at 20 °C | 5.2 × 10-6 [m/(mK)] |
| Thermal conductivity at 20 °C | 142 [W/(mK)] |
| Specific heat at 20 °C | 0.25 [J/(gK)] |
| Electrical conductivity at 20 °C | 17.9 × 106 [S/m] |
| Specific electrical resistance at 20 °C | 0.056 [(Ωmm2)/m] |
2.Molybdenum plates can be applied to component manufacturing in the semiconductor industry.
3.Molybdenum plates can also be made into molds.
