CMC (copper-molybdenum-copper) and CPC (copper-molybdenum copper-copper) are composite materials with a laminated structure. The core material of CMC is molybdenum, and the core material of CPC is molybdenum copper. The default is Mo70Cu30, with double-sided cladding. Take copper. This type of material is usually three layers of material, but can also be five layers or more.
We can produce CMC and CPC materials in any proportion. We can adjust the thermal conductivity and thermal expansion coefficient by adjusting the thickness ratio of each layer and the molybdenum-copper composition of the core material to obtain the required comprehensive performance.
Typical multilayer composite properties
|
Class |
Material |
Proportion of each floor |
Thermal expansion coefficient |
Thermal conductivity |
|
temperature～800 ℃ |
temperature/W(m·K)-1 |
|||
|
CMC111 |
Mo |
1:1:1 |
≤10.4 |
≥190 |
|
CMC121 |
Mo |
1:2:1 |
≤9.5 |
≥177 |
|
CMC131 |
Mo |
1:3:1 |
≤8.8 |
≥169 |
|
CMC141 |
Mo |
1:4:1 |
≤8.1 |
≥160 |
|
CMC31313 |
Mo |
3:1:3:1:3 |
≤10.0 |
≥270 |
|
CMC51515 |
Mo |
5:1:5:1:5 |
≤11.9 |
≥283 |
|
CPC111 |
Mo70Cu30 |
1:1:1 |
≤11.6 |
≥258 |
|
CPC232 |
Mo70Cu30 |
2:3:2 |
≤10.9 |
≥242 |
|
CPC121 |
Mo70Cu30 |
1:2:1 |
≤10.5 |
≥226 |
|
CPC131 |
Mo70Cu30 |
1:3:1 |
≤9.6 |
≥210 |
|
CPC141 |
Mo70Cu30 |
1:4:1 |
≤9.1 |
≥197 |
1.Since both surfaces of the multilayer composite material CMC/CPC are copper, it has excellent initial heat dissipation effect on the surface. As an electronic packaging material, it has better heat dissipation effect than molybdenum copper alloy. It is the preferred heat sink package for the new generation of high-power electrical appliances. Materials, applications have broad prospects.
2.Therefore, tungsten copper alloy has the characteristics of high strength, high specific gravity, high temperature resistance, arc ablation resistance, good electrical conductivity and electric heating performance, good processing performance, good arc breaking performance, good electrical conductivity, good thermal conductivity, small thermal expansion, and has the characteristics of sweating and cooling. ,Wide range of applications.
3.Since both surfaces of the multilayer composite material CMC/CPC are copper, it has excellent initial heat dissipation effect on the surface. As an electronic packaging material, it has better heat dissipation effect than molybdenum copper alloy. It is the preferred heat sink package for the new generation of high-power electrical appliances. Materials with broad application prospects.
